Invention Grant
- Patent Title: Forming catalytic sites from reducible silver complexes
- Patent Title (中): 从可还原的银络合物形成催化位点
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Application No.: US14571354Application Date: 2014-12-16
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Publication No.: US09586200B2Publication Date: 2017-03-07
- Inventor: Deepak Shukla , Kevin M. Donovan
- Applicant: Deepak Shukla , Kevin M. Donovan
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent J. Lanny Tucker
- Main IPC: H02K3/38
- IPC: H02K3/38 ; H05K1/03 ; C08F299/00 ; B32B15/08 ; C23C18/20 ; H01B5/14 ; H01B13/00 ; B01J37/34 ; B01J23/50 ; B01J37/02 ; B01J31/06 ; B01J37/16 ; C23C18/18 ; C23C18/16 ; C23C18/40 ; C23C18/34

Abstract:
A non-aqueous metal catalytic composition includes (a) a silver complex comprising reducible silver ions, (b) an organic phosphite, (c) an oxyazinium salt silver ion photoreducing agent, (d) a hindered pyridine, (e) a photocurable component, a non-curable polymer, or combination of a photocurable component and a non-curable polymer, and (f) a photosensitizer different from all components (a) through (e) in the non-aqueous metal catalytic composition, in an amount of at least 1 weight %. This non-aqueous metal catalytic composition can be used to form silver metal particles in situ during suitable reducing conditions. The silver metal can be provided in a suitable layer or pattern on a substrate, which can then be subsequently subjected to electroless plating to form electrically-conductive layers or patterns for use in various articles or as touch screen displays in electronic devices.
Public/Granted literature
- US20160167036A1 FORMING CATALYTIC SITES FROM REDUCIBLE SILVER COMPLEXES Public/Granted day:2016-06-16
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