Invention Grant
- Patent Title: Sheet-like heat pipe, and electronic device provided with same
- Patent Title (中): 片状热管,以及具有该片的热管
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Application No.: US14467928Application Date: 2014-08-25
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Publication No.: US09565786B2Publication Date: 2017-02-07
- Inventor: Hirofumi Aoki , Masami Ikeda
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-038136 20120224
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20 ; H01L23/427 ; F28D15/02 ; F28D15/04

Abstract:
A sheet-like heat pipe for a heat-generating element, which is intended to make an electronic device more compact, more lightweight, and thinner, while also reducing costs, is provided. A sheet-like heat pipe (10) of the present invention includes a container (17) in which the peripheries of the sheet-like members (11, 12) disposed facing each other are bonded to form a cavity inside, and a working liquid which is enclosed in a cavity (15) of the container (17). At least one of the sheet-like members (11, 12) disposed facing each other is formed with protruding pieces (12A, 12B) which project outwards from the bonded part with the other sheet-like member and have a spring structure which causes the container (17) to elastically abut a heat-generating element (5) of an electronic device.
Public/Granted literature
- US20140360701A1 SHEET-LIKE HEAT PIPE, AND ELECTRONIC DEVICE PROVIDED WITH SAME Public/Granted day:2014-12-11
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