Invention Grant
US09565770B2 Methods of making packages using thin Cu foil supported by carrier Cu foil
有权
使用由载体Cu箔支撑的薄Cu箔制造包装的方法
- Patent Title: Methods of making packages using thin Cu foil supported by carrier Cu foil
- Patent Title (中): 使用由载体Cu箔支撑的薄Cu箔制造包装的方法
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Application No.: US13962731Application Date: 2013-08-08
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Publication No.: US09565770B2Publication Date: 2017-02-07
- Inventor: Sehat Sutardja , Albert Wu , Hyun J Shin
- Applicant: Marvell World Trade Ltd.
- Applicant Address: BB St. Michael
- Assignee: Marvell World Trade Ltd.
- Current Assignee: Marvell World Trade Ltd.
- Current Assignee Address: BB St. Michael
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K3/00 ; H05K1/18 ; H01L21/48 ; H01L21/56 ; H01L23/31
Abstract:
In an embodiment, there is provided a method of creating a package, the method comprising: providing an initial substrate, wherein the initial substrate comprises a carrier foil, a functional copper foil, and an interface release layer between the carrier foil and the functional copper foil; building up copper portions on the functional copper foil; attaching a chip to a first copper portion; coupling the chip to a second copper portion; encapsulating at least the chip and the copper portions with a mold; and removing the carrier foil and interface release layer.
Public/Granted literature
- US20140041916A1 METHODS OF MAKING PACKAGES USING THIN CU FOIL SUPPORTED BY CARRIER CU FOIL Public/Granted day:2014-02-13
Information query
