Invention Grant
- Patent Title: Electronic component
- Patent Title (中): 电子元器件
-
Application No.: US15062477Application Date: 2016-03-07
-
Publication No.: US09565755B2Publication Date: 2017-02-07
- Inventor: Teru Nakanishi , Nobuyuki Hayashi , Masaru Morita , Yasuhiro Yoneda
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2009-069091 20090319
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14 ; H05K1/02 ; H01L23/13 ; H01L23/498 ; H05K3/34 ; H05K1/18 ; H01L23/00
Abstract:
A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
Public/Granted literature
- US20160192479A1 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT Public/Granted day:2016-06-30
Information query
