A camera module includes an imaging function section, a connector forming section, and a connecting section combined in a laminated body. The connecting section is thinner than the imaging function section and is bendable. The imaging function section includes a cavity and a through hole. An image sensor IC is disposed within the cavity. A lens unit is mounted in the imaging function section to be optically coupled to the image sensor IC via the through hole. A light shielding member covers a boundary between the connecting section and the imaging function section that define a height difference.