Invention Grant
- Patent Title: Fault tolerant chip-to-chip communication with advanced voltage
- Patent Title (中): 具有先进电压的容错芯片到芯片通信
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Application No.: US14498957Application Date: 2014-09-26
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Publication No.: US09564994B2Publication Date: 2017-02-07
- Inventor: Amin Shokrollahi , Roger Ulrich
- Applicant: Kandou Labs, S.A.
- Applicant Address: CH
- Assignee: KANDOU LABS, S.A.
- Current Assignee: KANDOU LABS, S.A.
- Current Assignee Address: CH
- Agency: Invention Mine LLC
- Main IPC: H04L1/00
- IPC: H04L1/00 ; H04L1/20 ; H04L1/22

Abstract:
Systems and circuits are described for transmitting data over physical channels to provide a fault tolerant, high speed, low latency interface such as between a memory controller and memory devices. Communications signals are communicated over interconnection groups comprised of multiple wires, with the described encoding and decoding permitting continued communication in the presence of a wire failure within an interconnection group. An efficient distributable voltage regulator to provide communications driver power is also disclosed.
Public/Granted literature
- US20150092532A1 Fault Tolerant Chip-to-Chip Communication with Advanced Voltage Regulator Public/Granted day:2015-04-02
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