Invention Grant
US09564671B2 Direct chip to waveguide transition including ring shaped antennas disposed in a thinned periphery of the chip
有权
直接芯片到波导过渡，包括设置在芯片的薄化周边的环形天线
- Patent Title: Direct chip to waveguide transition including ring shaped antennas disposed in a thinned periphery of the chip
- Patent Title (中): 直接芯片到波导过渡，包括设置在芯片的薄化周边的环形天线
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Application No.: US14583715Application Date: 2014-12-28
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Publication No.: US09564671B2Publication Date: 2017-02-07
- Inventor: Roi Carmon , Danny Elad , Noam Kaminski , Ofer Markish , Thomas Morf , Evgeny Shumaker
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: H01P5/107
- IPC: H01P5/107 ; H01P5/10
Abstract:
An apparatus providing a direct chip to waveguide transition, comprising: one or more waveguides, a chip partially embedding each of the waveguides at a transition area positioned at a narrow side of each waveguide, and a transmitting element disposed at each of the transition areas, thereby providing one or more simultaneous, direct transitions between the chip and the waveguides.
Public/Granted literature
- US20160190671A1 DIRECT AND COMPACT CHIP TO WAVEGUIDE TRANSITION Public/Granted day:2016-06-30
Information query
