Invention Grant
- Patent Title: Interconnector
- Patent Title (中): 互连器
-
Application No.: US12994515Application Date: 2009-07-10
-
Publication No.: US09564546B2Publication Date: 2017-02-07
- Inventor: Mitsuru Okubo
- Applicant: Mitsuru Okubo
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-185074 20080716
- International Application: PCT/JP2009/062593 WO 20090710
- International Announcement: WO2010/007946 WO 20100121
- Main IPC: H01L31/05
- IPC: H01L31/05 ; H01L27/142

Abstract:
An interconnector for electrically connecting a first electronic device element and a second electronic device element includes first and second connection portions which are respectively connected to electrodes of the first and second electronic device elements. A plurality of strip-like intermediate portions are each connected to both the first connection portion and the second connection portion to electrically connect the first connection portion and the second connection portion. The intermediate portions are mutually separated from one another in the width direction and mutually extending in parallel directions. Each intermediate portion has a first curved portion which is curved to be concave at one side of the respective intermediate portion in the width direction, and a second curved portion which is curved to be concave at another side of the respective intermediate portion in the width direction.
Public/Granted literature
- US20110067746A1 INTERCONNECTOR Public/Granted day:2011-03-24
Information query
IPC分类: