Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14927534Application Date: 2015-10-30
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Publication No.: US09564538B2Publication Date: 2017-02-07
- Inventor: Toshinari Sasaki
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: TYPHA IP LLC
- Priority: JP2014-221289 20141030
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L29/786 ; H01L29/423

Abstract:
A semiconductor device includes a first insulating layer having a first side wall, an oxide semiconductor layer located on the first side wall, a gate insulating layer located on the oxide semiconductor layer, the oxide semiconductor layer being located between the first side wall and the gate insulating layer, a gate electrode facing the oxide semiconductor layer located on the first side wall, the gate insulating layer being located between the oxide semiconductor layer and the gate electrode, a first electrode located below the oxide semiconductor layer and connected with one portion of the oxide semiconductor layer, and a second electrode located above the oxide semiconductor layer and connected with the other portion of the oxide semiconductor layer.
Public/Granted literature
- US20160126357A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-05-05
Information query
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