Invention Grant
- Patent Title: Epitaxy in semiconductor structure and manufacturing method thereof
- Patent Title (中): 半导体结构中的外延及其制造方法
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Application No.: US14180674Application Date: 2014-02-14
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Publication No.: US09564513B2Publication Date: 2017-02-07
- Inventor: Shih-Chieh Chang , Ying-Min Chou , Yi-Ming Huang , Chun-Ju Huang , Huai-Tei Yang , Kei-Wei Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agent Chun-Ming Shih
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/08 ; H01L29/78 ; H01L21/02

Abstract:
A semiconductor structure including a semiconductor substrate is provided. The semiconductor substrate includes a surface. A gate structure is provided on the surface. An interface lower than the surface is provided. An epitaxial regrowth region adjacent the gate structure is disposed on the interface. In addition, the epitaxial regrowth region extends over the surface and includes a bottom layer and a cap layer. The activation of the cap layer is lower than that of the bottom layer. Moreover, the bottom layer is lower than the surface and the gate structure. Furthermore, the bottom layer includes a first downwardly-curved edge and a second downwardly-curved edge over the first one. The first downwardly-curved edge is connected with the second downwardly-curved edge at two endpoints. The two endpoints are in contact with the surface of the semiconductor substrate.
Public/Granted literature
- US20150236124A1 EPITAXY IN SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-08-20
Information query
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