Invention Grant
US09564463B2 Methods of fabricating image sensors having deep trenches including negative charge material
有权
制造具有深沟槽的图像传感器的方法,包括负电荷材料
- Patent Title: Methods of fabricating image sensors having deep trenches including negative charge material
- Patent Title (中): 制造具有深沟槽的图像传感器的方法,包括负电荷材料
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Application No.: US15053356Application Date: 2016-02-25
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Publication No.: US09564463B2Publication Date: 2017-02-07
- Inventor: Hisanori Ihara
- Applicant: Hisanori Ihara
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2014-0023278 20140227
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/146

Abstract:
Image sensors are provided including a substrate defining a plurality of pixel regions, the substrate having a first surface and a second surface opposite the first surface. The second surface of the substrate is configured to receive light incident thereon and the substrate defines a deep trench extending from the second surface of the substrate toward the first surface substrate and separating the plurality of pixel regions from each other. In each of the plurality of pixel regions of the substrate, a photoelectric conversion region is provided. A gate electrode is provided on the photoelectric conversion region and a negative fixed charge layer covering the second surface of the substrate and at least a portion of a sidewall of the deep trench is also provided. The image sensors further include a shallow device isolation layer on the first surface of the substrate. The shallow device isolation layer defines an active region in each of the pixel regions and the negative fixed charge layer contacts the shallow device isolation layer.
Public/Granted literature
- US20160172391A1 Methods of Fabricating Image Sensors Having Deep Trenches Including Negative Charge Material Public/Granted day:2016-06-16
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