Invention Grant
US09564450B2 Nonvolatile semiconductor memory device and method of manufacturing the same 有权
非易失性半导体存储器件及其制造方法

Nonvolatile semiconductor memory device and method of manufacturing the same
Abstract:
According to one embodiment, a memory device includes first and second fin type stacked structures each includes first to i-th memory strings (i is a natural number except 1) that are stacked in a first direction, the first and second fin type stacked structures which extend in a second direction and which are adjacent in a third direction, a first portion connected to one end in the second direction of the first fin type stacked structure, a width in the third direction of the first portion being greater than a width in the third direction of the first fin type stacked structure, and a second portion connected to one end in the second direction of the second fin type stacked structure, a width in the third direction of the second portion being greater than a width in the third direction of the second fin type stacked structure.
Information query
Patent Agency Ranking
0/0