A semiconductor package structure and a method for manufacturing the same are provided. The semiconductor package structure comprises a substrate, a first chip, a first dielectric layer, a dielectric encapsulation layer and at least one first via. The first chip is disposed on the substrate. The first chip has a first landing area. The first dielectric layer is disposed on the first chip. The dielectric encapsulation layer encapsulates the first chip and the first dielectric layer. The at least one first via penetrates through the dielectric encapsulation layer and the first dielectric layer. The at least one first via connects to the first landing area of the first chip.