Invention Grant
- Patent Title: Thermal enhanced package using embedded substrate
- Patent Title (中): 热增强封装采用嵌入式基板
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Application No.: US13030470Application Date: 2011-02-18
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Publication No.: US09564391B2Publication Date: 2017-02-07
- Inventor: Kevin (Kunzhong) Hu , Edward Law
- Applicant: Kevin (Kunzhong) Hu , Edward Law
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox PLLC
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/36 ; H01L23/538 ; H01L23/00
Abstract:
An integrated circuit (IC) device is provided. The IC device includes an IC die having opposing first and second surfaces, a carrier coupled to the first surface of the IC die, a laminate coupled to the carrier and the second surface of the IC die, and a trace located on a surface of the laminate and electrically coupled to a bond pad located on the second surface of the IC die. The trace is configured to couple the bond pad to a circuit board.
Public/Granted literature
- US20120175773A1 Thermal Enhanced Package Using Embedded Substrate Public/Granted day:2012-07-12
Information query
IPC分类:
