A method of and device for making a semiconductor package. The method comprises etching a first side of a metallic piece forming a leadframe with one or more wire bonding pads, applying a first protective layer on the first side, etching a second side of the metallic piece forming one or more conductive terminals, and applying a second protective layer on the second side. The semiconductor package comprises wire bonding pads in pillars structure surrounding a die attached to the leadframe. One or more terminals are on the bottom side of the semiconductor package.