Invention Grant
- Patent Title: Semiconductor package with structures for cooling fluid retention
- Patent Title (中): 具有冷却液保留结构的半导体封装
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Application No.: US14938944Application Date: 2015-11-12
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Publication No.: US09564386B2Publication Date: 2017-02-07
- Inventor: Wei Lin , Son V. Nguyen , Spyridon Skordas , Tuan A. Vo
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent David B. Woycechowsky
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/473 ; H01L23/467 ; H01L23/04 ; H01L21/48 ; H01L23/06 ; H01L23/10 ; H01L23/367 ; H01L25/065

Abstract:
A semiconductor assembly for use with forced liquid and gas cooling. A relatively rigid nano-structure (for example, array of elongated nanowires) extends from an interior surface of a cap toward a top surface of a semiconductor chip, but, because of the rigidness and structural integrity of the nano-structure built into the cap, and of the cap itself, the nano-structure is reliably spaced apart from the top surface of the chip, which helps allow for appropriate cooling fluid flows. The cap piece and nano-structures built into the cap may be made of silicon or silicon compounds.
Public/Granted literature
- US20160064307A1 LIQUID COOLING OF SEMICONDUCTOR CHIPS UTILIZING SMALL SCALE STRUCTURES Public/Granted day:2016-03-03
Information query
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