Invention Grant
- Patent Title: Positioning frame structure
- Patent Title (中): 定位框架结构
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Application No.: US14584207Application Date: 2014-12-29
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Publication No.: US09564351B2Publication Date: 2017-02-07
- Inventor: Tianshun Wu , Chengwei Huang , Xiaochi Xu
- Applicant: Sensata Technologies (Changzhou) Co., Ltd.
- Applicant Address: US MA Attleboro
- Assignee: SENSATA TECHNOLOGIES, INC.
- Current Assignee: SENSATA TECHNOLOGIES, INC.
- Current Assignee Address: US MA Attleboro
- Agency: Adler Pollock & Sheehan P.C.
- Agent George N. Chaclas, Esq.; Daniel J. Holmander, Esq.
- Priority: CN201310752418 20131231
- Main IPC: A47B91/00
- IPC: A47B91/00 ; H01L21/68 ; H01L21/673 ; G01P1/02 ; G01P3/488 ; G01D11/24 ; G01D11/30
Abstract:
A positioning frame structure for the centering and positioning of an IC is disclosed, in which the positioning frame structure comprises an IC carrier having a first chamber defined therein and an IC positioning magnet disposed in the first chamber of the IC carrier. The positioning frame structure further comprises an IC holder disposed over the IC positioning magnet, and the IC is held on the IC holder, so as to provide centering and positioning of the IC relative to the IC positioning magnet. The present invention can be used to control the centering and positioning of the IC and the positioning magnet on the carrier. The positioning magnet can be made to be larger than the IC. In addition, a large air gap can be obtained so as to facilitate the subsequent operation of the IC. Furthermore, without the operation using adhesive, the technical solution of the present invention saves the cost of operation.
Public/Granted literature
- US20150187623A1 POSITIONING FRAME STRUCTURE Public/Granted day:2015-07-02
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