Invention Grant
- Patent Title: Laminating magnetic cores for on-chip magnetic devices
- Patent Title (中): 用于片上磁性器件的层压磁芯
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Application No.: US15149727Application Date: 2016-05-09
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Publication No.: US09564165B2Publication Date: 2017-02-07
- Inventor: Robert E. Fontana, Jr. , William J. Gallagher , Philipp Herget , Eugene J. O'Sullivan , Lubomyr T. Romankiw , Naigang Wang , Bucknell C. Webb
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: B32B15/00
- IPC: B32B15/00 ; G11B5/66 ; C25D7/00 ; C25D7/12 ; C25D3/54 ; C25D5/10 ; C25D5/14 ; C25D9/10 ; H01F10/32 ; C25D3/58 ; C25D5/18 ; C25D5/50
Abstract:
A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.
Public/Granted literature
- US20160260451A1 LAMINATING MAGNETIC CORES FOR ON-CHIP MAGNETIC DEVICES Public/Granted day:2016-09-08
Information query
