Invention Grant
- Patent Title: Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive
- Patent Title (中): 用于悬挂的基板,其制造工艺,磁头悬挂和硬盘驱动器
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Application No.: US14551663Application Date: 2014-11-24
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Publication No.: US09564153B2Publication Date: 2017-02-07
- Inventor: Yoichi Hitomi , Shinji Kumon , Terutoshi Momose , Katsuya Sakayori , Kiyohiro Takachi , Yoichi Miura , Tsuyoshi Yamazaki
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Shinjuku-Ku
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Shinjuku-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2007-109279 20070418; JP2007-126588 20070511
- Main IPC: G11B5/60
- IPC: G11B5/60 ; B05D5/12 ; H05K1/05 ; G11B5/48 ; H05K3/28 ; G11B5/31

Abstract:
A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10−6/% RH and 30×10−6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10−6/% RH or less.
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