Invention Grant
US09563122B2 Method to harden photoresist for directed self-assembly processes
有权
硬化用于定向自组装工艺的光致抗蚀剂的方法
- Patent Title: Method to harden photoresist for directed self-assembly processes
- Patent Title (中): 硬化用于定向自组装工艺的光致抗蚀剂的方法
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Application No.: US14697669Application Date: 2015-04-28
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Publication No.: US09563122B2Publication Date: 2017-02-07
- Inventor: Joy Cheng , Matthew E. Colburn , Chi-Chun Liu
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris, Esq.
- Main IPC: G03F7/40
- IPC: G03F7/40 ; G03F7/039 ; H01L21/308
Abstract:
A patterned photoresist is provided atop a substrate. A hardening agent is applied to the patterned photoresist to provide a polymeric coated patterned photoresist. The polymeric coated patterned photoresist is baked to provide a hardened photoresist, and subsequent the baking step, the polymeric coating is removed from the hardened photoresist by rinsing. The hardened photoresist can be removed anytime during the patterning of the substrate by an aqueous resist developer.
Public/Granted literature
- US20160320701A1 METHOD TO HARDEN PHOTORESIST FOR DIRECTED SELF-ASSEMBLY PROCESSES Public/Granted day:2016-11-03
Information query
IPC分类:
