Invention Grant
- Patent Title: Self bonding floor tile
- Patent Title (中): 自粘地砖
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Application No.: US14262792Application Date: 2014-04-27
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Publication No.: US09562363B2Publication Date: 2017-02-07
- Inventor: Hsiung-Tieh Yu , Shih-Chung Lee
- Applicant: Shanghai Jinka Flooring Technology Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI JINKA FLOORING TECHNOLOGY CO., LTD.
- Current Assignee: SHANGHAI JINKA FLOORING TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shanghai
- Agent Cheng-Ju Chiang
- Priority: CN201010522705 20101026
- Main IPC: E04F15/02
- IPC: E04F15/02 ; E04C2/24 ; B32B3/26 ; B32B3/30 ; B32B5/00 ; E04F15/10

Abstract:
A self bonding floor tile includes a main body and a self bonding layer connected with the main body. The self bonding layer includes an absorptive element, a first adhesive and a second adhesive. The first adhesive connects the main body with the self bonding layer. The absorptive element includes a plurality of fibers which are implanted into the first adhesive by flocking process with at least a portion of the absorptive element extending into the first adhesive, and at least a portion of the second adhesive penetrates into the other portion of the absorptive element for connecting the self bonding layer with a support body going to be decorated. The present self bonding floor tile can be quickly installed, easily and partly replaced with low installation and replacement cost.
Public/Granted literature
- US20140227475A1 SELF BONDING FLOOR TILE Public/Granted day:2014-08-14
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