Invention Grant
- Patent Title: Electronic device and method for manufacturing housing for same
- Patent Title (中): 电子设备及其制造方法
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Application No.: US14446503Application Date: 2014-07-30
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Publication No.: US09538673B2Publication Date: 2017-01-03
- Inventor: Shyan-Juh Liu , Kar-Wai Hon , Sha-Sha Liu
- Applicant: Fu Tai Hua Industry (Shenzhen) Co., Ltd. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agent Zhigang Ma
- Priority: CN201310324648 20130730
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/02 ; G06F1/20
Abstract:
An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.
Public/Granted literature
- US20150036295A1 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING HOUSING FOR SAME Public/Granted day:2015-02-05
Information query
