Invention Grant
- Patent Title: Combined wiring board and method for manufacturing combined wiring board
- Patent Title (中): 组合线路板及组合线路板的制造方法
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Application No.: US14077563Application Date: 2013-11-12
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Publication No.: US09538663B2Publication Date: 2017-01-03
- Inventor: Teruyuki Ishihara , Michimasa Takahashi
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-247048 20121109
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K3/00
Abstract:
A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the metal frame, and subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the metal frame inside the accommodation opening portion of the metal frame.
Public/Granted literature
- US20140133111A1 COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD Public/Granted day:2014-05-15
Information query
