Invention Grant
- Patent Title: High-frequency signal transmission line and electronic device
- Patent Title (中): 高频信号传输线和电子设备
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Application No.: US14520504Application Date: 2014-10-22
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Publication No.: US09538638B2Publication Date: 2017-01-03
- Inventor: Kuniaki Yosui , Noboru Kato
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-226568 20121012; JP2013-030024 20130219
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H05K1/02 ; H05K1/11 ; H05K1/14

Abstract:
A high-frequency signal transmission line includes a dielectric element assembly including a plurality of dielectric layers laminated on each other, a linear signal line provided at the dielectric element assembly, and a first ground conductor provided on a first side in a direction of lamination relative to the signal line and including a plurality of openings arranged along the signal line. The dielectric layer positioned at an end of the first side in the direction of lamination includes an undulating portion provided on a first principal surface located on the first side in the direction of lamination, such that the undulating portion overlaps with the openings when viewed in a plan view in the direction of lamination.
Public/Granted literature
- US20150036303A1 HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE Public/Granted day:2015-02-05
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