Invention Grant
- Patent Title: Multichannel RF feedthroughs
- Patent Title (中): 多通道RF馈通
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Application No.: US13533895Application Date: 2012-06-26
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Publication No.: US09538637B2Publication Date: 2017-01-03
- Inventor: Yan yang Zhao , Bernd Huebner , Tengda Du , Yuheng Lee
- Applicant: Yan yang Zhao , Bernd Huebner , Tengda Du , Yuheng Lee
- Applicant Address: US CA Sunnyvale
- Assignee: FINISAR CORPORATION
- Current Assignee: FINISAR CORPORATION
- Current Assignee Address: US CA Sunnyvale
- Agency: Maschoff Brennan
- Main IPC: G01J1/42
- IPC: G01J1/42 ; H05K1/02 ; H05K1/11 ; H05K1/14 ; G02B6/42

Abstract:
Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.
Public/Granted literature
- US20130001410A1 MULTICHANNEL RF FEEDTHROUGHS Public/Granted day:2013-01-03
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