Invention Grant
- Patent Title: Earpiece system
- Patent Title (中): 听筒系统
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Application No.: US14250375Application Date: 2014-04-10
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Publication No.: US09538281B2Publication Date: 2017-01-03
- Inventor: Seth D. Burgett , Richard J. Daniels , Melvin Joshua Leedle
- Applicant: Harman International Industries, Incorporated
- Applicant Address: US CA Northridge
- Assignee: Harman International Industries, Incorporated
- Current Assignee: Harman International Industries, Incorporated
- Current Assignee Address: US CA Northridge
- Agency: Brooks Kushman P.C.
- Main IPC: H04R1/10
- IPC: H04R1/10
Abstract:
An earbud adapter or in-ear monitor includes an Ear Interface that fits the human ear and further permits the wearer of these devices to adjust parameters of the fit. In additional aspects, the Ear Interface portion of these devices permits the user to adjust the transmission of ambient sound. The Ear Interface portion also allows the user to change ornamentation.
Public/Granted literature
- US20150030194A1 EARPIECE SYSTEM Public/Granted day:2015-01-29
Information query
