Invention Grant
- Patent Title: Semiconductor laser device assembly
- Patent Title (中): 半导体激光器件组装
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Application No.: US14390689Application Date: 2013-04-03
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Publication No.: US09537288B2Publication Date: 2017-01-03
- Inventor: Hideki Watanabe , Shunsuke Kono , Masaru Kuramoto
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2012-088627 20120409
- International Application: PCT/JP2013/060163 WO 20130403
- International Announcement: WO2013/153999 WO 20131017
- Main IPC: H01S3/08
- IPC: H01S3/08 ; H01S5/12 ; H01S5/323 ; H01S5/14 ; B82Y20/00 ; H01S5/0625 ; H01S3/105 ; H01S5/065 ; H01S5/10 ; H01S5/22 ; H01S5/32 ; H01S5/343

Abstract:
A semiconductor laser device assembly includes (A) a semiconductor laser element and (B) a diffraction grating that configures an external resonator, returns diffraction light other than zero-th order diffraction light to the semiconductor laser element, and outputs the zero-th order diffraction light to the outside. An extension direction of a diffraction surface of the diffraction grating and a main vibration direction of a field of a laser beam incident on the diffraction grating are substantially parallel to each other.
Public/Granted literature
- US20150085891A1 SEMICONDUCTOR LASER DEVICE ASSEMBLY Public/Granted day:2015-03-26
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