Invention Grant
- Patent Title: Circuit system and manufacturing method for same
- Patent Title (中): 电路系统及制造方法相同
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Application No.: US14404706Application Date: 2013-04-11
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Publication No.: US09537286B2Publication Date: 2017-01-03
- Inventor: Andreas Letsch , Hans-Jochen Schwarz , Martin Astner
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Norton Rose Fulbright US LLP
- Agent Gerard Messina
- Priority: DE102012209266 20120601
- International Application: PCT/EP2013/057545 WO 20130411
- International Announcement: WO2013/178397 WO 20131205
- Main IPC: H01S3/00
- IPC: H01S3/00 ; H01S5/00 ; H01S5/026 ; H01S5/40 ; H01S5/42 ; H01S5/022
Abstract:
A circuit system includes: a first optoelectronic semiconductor component situated with an n-conductive surface facing an electrically conductive support surface and connected to the support surface in an electrically conductive manner; and a second optoelectronic semiconductor component situated with a p-conductive surface facing the support surface and connected to the support surface in an electrically conductive manner.
Public/Granted literature
- US20150110140A1 CIRCUIT SYSTEM AND MANUFACTURING METHOD FOR SAME Public/Granted day:2015-04-23
Information query
