Invention Grant
- Patent Title: Transmission line implementation in wafer-level packaging
- Patent Title (中): 晶圆级封装中的传输线实现
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Application No.: US14559503Application Date: 2014-12-03
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Publication No.: US09537197B2Publication Date: 2017-01-03
- Inventor: Darryl Jessie , Lan Nan
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01P3/00
- IPC: H01P3/00 ; H01L23/00 ; H01L23/66 ; H01L21/768 ; H01L23/528
Abstract:
In an integrated circuit package that houses radio-frequency (RF) circuits or components using wafer-level packaging (WLP), an RF-signal transmission structure includes a signal-carrying conductive line positioned between grounded conductive lines to avoid undesirable coupling between the signal-carrying conductive line and other RF circuits or components in the same package.
Public/Granted literature
- US20160164158A1 TRANSMISSION LINE IMPLEMENTATION IN WAFER-LEVEL PACKAGING Public/Granted day:2016-06-09
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