Invention Grant
- Patent Title: Semiconductor device with an epitaxial layer and method of fabricating the same
- Patent Title (中): 具有外延层的半导体器件及其制造方法
-
Application No.: US14582294Application Date: 2014-12-24
-
Publication No.: US09537029B2Publication Date: 2017-01-03
- Inventor: Beom Seok Kim , Bongjin Kuh , Jongsung Lim , Hanmei Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse P.C.
- Priority: KR10-2014-0026139 20140305
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L31/0352 ; H01L31/18

Abstract:
A semiconductor device includes a first semiconductor layer including a recess region and protrusions defined by the recessed region, first insulating patterns provided on the protrusions and extending to sidewalls of the protrusions, and a second semiconductor layer to fill the recess region and cover the first insulating patterns. The protrusions includes a first group of protrusions spaced apart from each other in a first direction to constitute a row and a second group of protrusions spaced from the first group of protrusions in a second direction intersecting the first direction and spaced from each other in the first direction to constitute a row. The second group of protrusions are shifted from the first group of protrusions in the first direction.
Public/Granted literature
- US20150255649A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-09-10
Information query
IPC分类: