Invention Grant
US09537024B2 Metal-dielectric hybrid surfaces as integrated optoelectronic interfaces
有权
金属 - 电介质混合表面作为集成的光电接口
- Patent Title: Metal-dielectric hybrid surfaces as integrated optoelectronic interfaces
- Patent Title (中): 金属 - 电介质混合表面作为集成的光电接口
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Application No.: US15142851Application Date: 2016-04-29
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Publication No.: US09537024B2Publication Date: 2017-01-03
- Inventor: Vijay K. Narasimhan , Thomas M. Hymel , Ruby A. Lai , Yi Cui
- Applicant: The Board of Trustees of the Leland Stanford Junior University
- Applicant Address: US CA Palo Alto
- Assignee: The Board of Trustees of the Leland Stanford Junior University
- Current Assignee: The Board of Trustees of the Leland Stanford Junior University
- Current Assignee Address: US CA Palo Alto
- Agency: Lumen Patent Firm
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H01L31/0232 ; H01L33/38 ; H01L33/44 ; H01L31/0216 ; H01L31/0687 ; H01L31/0725 ; H01L31/0236 ; H01L31/0224
Abstract:
An optoelectronic device has a hybrid metal-dielectric optoelectronic interface including an array of nanoscale dielectric resonant elements (e.g., nanopillars), and a metal film disposed between the dielectric resonant elements and below a top surface of the resonant elements such that the dielectric resonant elements protrude through the metal film. The device may also include an anti-reflection coating. The device may further include a metal film layer on each of the dielectric resonant elements.
Public/Granted literature
- US20160322517A1 Metal-dielectric hybrid surfaces as integrated optoelectronic interfaces Public/Granted day:2016-11-03
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