Invention Grant
- Patent Title: Semiconductor device comprising a field electrode
- Patent Title (中): 包括场电极的半导体装置
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Application No.: US14748712Application Date: 2015-06-24
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Publication No.: US09536960B2Publication Date: 2017-01-03
- Inventor: David Laforet , Franz Hirler , Oliver Blank , Ralf Siemieniec
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102014109859 20140714
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L29/40 ; H01L29/423 ; H01L29/78

Abstract:
A semiconductor device includes a gate electrode adjacent to a body region in a semiconductor substrate. The semiconductor device further includes a field electrode in a field plate trench in the main surface, the field plate trench having an extension length in a first direction parallel to a main surface. The extension length is less than the double of an extension length in a second direction that is perpendicular to the first direction parallel to the main surface. The extension length in the first direction is more than half of the extension length in the second direction. The field electrode is insulated from an adjacent drift zone by means of a field dielectric layer. A field plate material of the field electrode has a resistivity in a range from 105 to 10−1 Ohm·cm.
Public/Granted literature
- US20160013280A1 Semiconductor Device Comprising a Field Electrode Public/Granted day:2016-01-14
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