Invention Grant
- Patent Title: Semiconductor chip including integrated circuit having cross-coupled transistor configuration and method for manufacturing the same
- Patent Title (中): 包括具有交叉耦合晶体管配置的集成电路的半导体芯片及其制造方法
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Application No.: US14945361Application Date: 2015-11-18
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Publication No.: US09536899B2Publication Date: 2017-01-03
- Inventor: Scott T. Becker , Jim Mali , Carole Lambert
- Applicant: Tela Innovations, Inc.
- Applicant Address: US CA Los Gatos
- Assignee: Tela Innovations, Inc.
- Current Assignee: Tela Innovations, Inc.
- Current Assignee Address: US CA Los Gatos
- Agency: Martine Penilla Group, LLP
- Main IPC: G11C11/412
- IPC: G11C11/412 ; H01L27/118 ; H01L27/11 ; G11C5/06 ; H01L27/02 ; H01L27/092 ; G06F17/50 ; H01L27/088 ; H01L23/538 ; H01L23/498 ; H01L21/8234 ; H01L23/528

Abstract:
A first conductive structure forms gate electrodes of a first transistor of a first transistor type and a first transistor of a second transistor type. A second conductive structure forms a gate electrode of a second transistor of the first transistor type. A third conductive structure forms a gate electrode of a second transistor of the second transistor type. A fourth conductive structure forms a gate electrode of a third transistor of the first transistor type. A fifth conductive structure forms a gate electrode of a third transistor of the second transistor type. A sixth conductive structure forms gate electrodes of a fourth transistor of the first transistor type and a fourth transistor of the second transistor type. The second and third transistors of the first transistor type and the second and third transistors of the second transistor type are electrically connected to form a cross-coupled transistor configuration.
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