Invention Grant
US09536896B2 Non-volatile memory device having a vertical structure and method of fabricating the same 有权
具有垂直结构的非易失性存储器件及其制造方法

Non-volatile memory device having a vertical structure and method of fabricating the same
Abstract:
A non-volatile memory device having a vertical structure includes a semiconductor layer, a sidewall insulation layer extending in a vertical direction on the semiconductor layer, and having one or more protrusion regions, first control gate electrodes arranged in the vertical direction on the semiconductor layer, and respectively contacting one of portions of the sidewall insulation layer where the one or more protrusion regions are not formed and second control gate electrodes arranged in the vertical direction on the semiconductor layer, and respectively contacting one of the one or more protrusion regions.
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