Invention Grant
- Patent Title: Three-dimensional memory and method for manufacturing the same
- Patent Title (中): 三维记忆及其制造方法
-
Application No.: US14541169Application Date: 2014-11-14
-
Publication No.: US09536893B2Publication Date: 2017-01-03
- Inventor: Yi-Hsuan Hsiao , Wei-Chen Chen
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/283
- IPC: H01L21/283 ; H01L23/48 ; H01L23/535 ; H01L21/768 ; H01L23/528 ; H01L27/115

Abstract:
A three-dimensional (3D) memory and a method for manufacturing the same are disclosed. According to one embodiment, the 3D memory comprises a thin-film transistor. The thin-film transistor has a source region and a drain region disposed separately. The source region comprises a first source region and a second source region disposed between the first source region and the drain region. The first source region is p-type of doping, the second source region is n-type of doping, and the drain region is n-type of doping.
Public/Granted literature
- US20160141300A1 THREE-DIMENSIONAL MEMORY AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-05-19
Information query
IPC分类: