Invention Grant
- Patent Title: Aspect ratio for semiconductor on insulator
- Patent Title (中): 半导体绝缘体的长宽比
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Application No.: US14725400Application Date: 2015-05-29
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Publication No.: US09536775B2Publication Date: 2017-01-03
- Inventor: Effendi Leobandung
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Louis J. Percello
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/762 ; H01L21/3205 ; H01L21/3213

Abstract:
A method comprises forming one or more fins in a first region on an insulated substrate. The method also comprises forming one or more fins formed in a second region on the insulated substrate. The insulated substrate comprising a silicon substrate, and an insulator layer deposited on the silicon substrate. The one or more fins in the first region comprising a first material layer deposited on the insulator layer. The one or more fins in the second region comprising a second material layer deposited on the insulator layer.
Public/Granted literature
- US20160351439A1 ASPECT RATIO FOR SEMICONDUCTOR ON INSULATOR Public/Granted day:2016-12-01
Information query
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