Invention Grant
- Patent Title: Electrostatic carrier for thin substrate handling
- Patent Title (中): 用于薄基板处理的静电载体
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Application No.: US14451167Application Date: 2014-08-04
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Publication No.: US09536768B2Publication Date: 2017-01-03
- Inventor: Michael S. Cox
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01T23/00
- IPC: H01T23/00 ; H01L21/683

Abstract:
Embodiments provided herein generally relate to an electrostatic chuck (ESC). The ESC may comprise a reduced number of stress initiation points, such as holes through the ESC, which may improve the mechanical integrity of the ESC. Electrodes disposed within the ESC may be connected to electrical contacts and a power source via conductive leads, which may be coupled or formed along a peripheral edge of the ESC. Thus, the need for holes formed in the ESC may be reduced or eliminated. In addition, gas channels may be formed on a top surface, a bottom surface, or both. The gas channels may reduce or eliminate the need for a gas channel formed through the ESC and may facilitate heat transfer between a substrate support, the ESC, and a substrate coupled to the ESC.
Public/Granted literature
- US20150036260A1 ELECTROSTATIC CARRIER FOR THIN SUBSTRATE HANDLING Public/Granted day:2015-02-05
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