Invention Grant
US09536764B2 End effector for wafer transfer system and method of transferring wafers
有权
用于晶片传输系统的末端执行器和转移晶片的方法
- Patent Title: End effector for wafer transfer system and method of transferring wafers
- Patent Title (中): 用于晶片传输系统的末端执行器和转移晶片的方法
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Application No.: US14606664Application Date: 2015-01-27
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Publication No.: US09536764B2Publication Date: 2017-01-03
- Inventor: Ross Embertson , Brandon Senn
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B25J15/00 ; B25J11/00 ; B25J15/08

Abstract:
An end effector of a wafer transfer system includes synchronously movable blades operable to hold and release wafers. The end effector comprises an end effector housing including a first blade mount coupled to a first blade, a second blade mount coupled to a second blade, and an actuator operable to move the blade mounts on respective linear rails. The actuator includes a longitudinally movable piston coupled to the respective blade mounts by respective actuator links. The actuator links are pivotally coupled to the longitudinally movable piston at respective first ends thereof and to the first and second blade mounts at respective second ends thereof wherein moving the piston towards a retracted position causes the blades to synchronously move laterally towards each other and moving the piston towards the retracted position causes the blades to synchronously move laterally away from each other so as to hold or release a wafer.
Public/Granted literature
- US20160218030A1 END EFFECTOR FOR WAFER TRANSFER SYSTEM AND METHOD OF TRANSFERRING WAFERS Public/Granted day:2016-07-28
Information query
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