A semiconductor die encapsulation or carrier-mounting method and apparatus for manufacturing a semiconductor product, wherein a first tool part for holding multiple semiconductor dies is provided and the semiconductor dies are placed on the first tool part, one of the first and a second tool part including displaceable insert members applying a pressure by each displaceable insert member on a surface area of the semiconductor die, and the first and second tool parts are brought together to define a space between the first and second tool parts with the semiconductor products being arranged within the space. The pressure applied by the displaceable insert members is monitored and regulated to a predetermined pressure, and subsequently, the first and second tool parts are separated and the processed semiconductor dies removed.