Invention Grant
US09536752B2 Slurry for chemical mechanical polishing and polishing method for substrate using same
有权
用于使用其的基板的化学机械抛光和抛光方法的浆料
- Patent Title: Slurry for chemical mechanical polishing and polishing method for substrate using same
- Patent Title (中): 用于使用其的基板的化学机械抛光和抛光方法的浆料
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Application No.: US13508924Application Date: 2010-11-08
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Publication No.: US09536752B2Publication Date: 2017-01-03
- Inventor: Minori Takegoshi , Mitsuru Kato , Chihiro Okamoto , Shinya Kato
- Applicant: Minori Takegoshi , Mitsuru Kato , Chihiro Okamoto , Shinya Kato
- Applicant Address: JP Kurashiki-shi
- Assignee: KURARAY CO., LTD.
- Current Assignee: KURARAY CO., LTD.
- Current Assignee Address: JP Kurashiki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-258444 20091111
- International Application: PCT/JP2010/069851 WO 20101108
- International Announcement: WO2011/058952 WO 20110519
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/306 ; H01L21/3105 ; C09K3/14 ; H01L21/762
Abstract:
The present invention provides a slurry for chemical mechanical polishing comprising water-soluble clathrate compound (a), polymer compound (b) having an acidic group optionally in a salt form as a side chain, polishing abrasive grain (c) and water (d), wherein the content of the water-soluble clathrate compound (a) is 0.001 mass %-3 mass % of the total amount of the slurry, the polymer compound (b) has a weight average molecular weight of not less than 1,000 and less than 1,000,000, and the content of the polymer compound (b) is 0.12 mass %-3 mass % of the total amount of the slurry, and a polishing method for substrate using the slurry.
Public/Granted literature
- US20120270400A1 SLURRY FOR CHEMICAL MECHANICAL POLISHING AND POLISHING METHOD FOR SUBSTRATE USING SAME Public/Granted day:2012-10-25
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