Invention Grant
- Patent Title: Chip electronic component and method of manufacturing the same
- Patent Title (中): 芯片电子部件及其制造方法
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Application No.: US14478728Application Date: 2014-09-05
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Publication No.: US09536660B2Publication Date: 2017-01-03
- Inventor: Moon Soo Park , Tae Young Kim , Dong Hwan Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Seoul KR Seoul
- Assignee: HYUNDAI MOTOR COMPANY,KIA MOTOR CORPORATION
- Current Assignee: HYUNDAI MOTOR COMPANY,KIA MOTOR CORPORATION
- Current Assignee Address: KR Seoul KR Seoul
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0077155 20140624
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/24 ; H01F27/02 ; H01F41/04 ; H01F27/255 ; H01F17/00 ; H01F27/29 ; H01F3/10

Abstract:
A chip electronic component may include: a magnetic body; and internal coil parts buried in the magnetic body. The magnetic body includes: a core layer including the internal coil parts; and upper and lower cover layers disposed on upper and lower portions of the core layer, respectively, the core layer having a level of magnetic permeability different from that of at least one of the upper and lower cover layers.
Public/Granted literature
- US20150371752A1 CHIP ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-12-24
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