Invention Grant
- Patent Title: Ad hoc digital multi-die polling for peak ICC management
- Patent Title (中): 用于峰值ICC管理的Ad hoc数字多芯片轮询
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Application No.: US14928992Application Date: 2015-10-30
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Publication No.: US09536617B2Publication Date: 2017-01-03
- Inventor: Ali Al-Shamma , Farookh Moogat , Chang Siau , Grishma Shah , Kenneth Louie , Khanh Nguyen , Kapil Verma
- Applicant: SANDISK TECHNOLOGIES INC.
- Applicant Address: US TX Plano
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus LLP
- Main IPC: G11C16/06
- IPC: G11C16/06 ; G11C16/30 ; G11C16/24

Abstract:
Systems and methods for reducing peak power supply current in a non-volatile memory system that includes a plurality of memory die are described. In some cases, prior to a first memory die of the plurality of memory die performing a particular memory operation (e.g., a programming operation), the first memory die may poll other memory die of the plurality of memory die to determine a total peak power supply current for the plurality of memory die. In response to detecting that the total peak power supply current for the plurality of memory die is at or above a peak current threshold (e.g., more than 200 mA), the first memory die may delay the performance of the particular memory operation or slow down the performance of the particular memory operation.
Public/Granted literature
- US20160293264A1 AD HOC DIGITAL MULTI-DIE POLLING FOR PEAK ICC MANAGEMENT Public/Granted day:2016-10-06
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