Invention Grant
- Patent Title: Information processing device and method of manufacturing information processing device
- Patent Title (中): 信息处理装置及其制造方法信息处理装置
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Application No.: US14577074Application Date: 2014-12-19
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Publication No.: US09535462B2Publication Date: 2017-01-03
- Inventor: Manabu Watabe , Hidenobu Maruyama , Takahiro Totuka , Yasunori Kimura , Takanori Takei , Tomoyuki Tsukamoto , Kiyokuni Arima , Shingo Harada
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Paratus Law Group, PLLC
- Priority: JP2013-271482 20131227; JP2013-273223 20131227; JP2013-273224 20131227
- Main IPC: G06F1/16
- IPC: G06F1/16
Abstract:
There is provided an information processing device including a casing in which a top surface, a bottom surface, and side surfaces are integrally formed, and an opening portion which is formed in one of the top surface, the bottom surface, and the side surfaces and through which each component to be mounted inside the casing is inserted.
Public/Granted literature
- US20150185784A1 INFORMATION PROCESSING DEVICE AND METHOD OF MANUFACTURING INFORMATION PROCESSING DEVICE Public/Granted day:2015-07-02
Information query
