Invention Grant
US09534310B2 Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
有权
用于垂直电镀金属的装置，优选铜，沉积在基板上，以及适于接收这种装置的容器
- Patent Title: Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
- Patent Title (中): 用于垂直电镀金属的装置，优选铜，沉积在基板上，以及适于接收这种装置的容器
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Application No.: US14649003Application Date: 2013-12-03
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Publication No.: US09534310B2Publication Date: 2017-01-03
- Inventor: Ralph Rauenbusch , Christian Thomas , Ray Weinhold , Heinz Klingl
- Applicant: Atotech Deutschland GmbH
- Applicant Address: DE Berlin
- Assignee: Atotech Deutschland GmbH
- Current Assignee: Atotech Deutschland GmbH
- Current Assignee Address: DE Berlin
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: EP12075143 20121220
- International Application: PCT/EP2013/075411 WO 20131203
- International Announcement: WO2014/095355 WO 20140626
- Main IPC: C25D17/00
- IPC: C25D17/00 ; C25D17/12 ; C25D17/06 ; C25D7/12 ; C25D5/08
Abstract:
The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate, a container suitable for receiving such a device and a substrate holder, which is suitable for receiving a substrate to be treated, and the use of such a device inside of such a container for galvanic metal, in particular copper, deposition on a substrate.
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