Invention Grant
- Patent Title: Resist underlayer film-forming composition
- Patent Title (中): 抗蚀剂下层成膜组合物
-
Application No.: US14655797Application Date: 2013-12-17
-
Publication No.: US09534140B2Publication Date: 2017-01-03
- Inventor: Tomoya Ohashi , Shigeo Kimura , Hiroto Ogata
- Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
- Current Assignee: NISSAN CHEMICAL INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2013-001857 20130109
- International Application: PCT/JP2013/083752 WO 20131217
- International Announcement: WO2014/109186 WO 20140717
- Main IPC: C09D167/04
- IPC: C09D167/04 ; G03F7/11 ; G03F7/09 ; C08G63/06 ; C08J3/09 ; C08K3/00 ; C08K5/00

Abstract:
There is provided a resist underlayer film-forming composition having excellent solubility in a solvent containing propylene glycol monomethyl ether as a main component. A resist underlayer film-forming composition comprising a polymer having a structural unit of Formula (1a) or Formula (1c) and a structural unit of Formula (1b) and a solvent containing more than 50% by mass of propylene glycol monomethyl ether, wherein in the polymer, the structural unit of Formula (1a) or Formula (1c) and the structural unit of Formula (1b) are arranged alternately. (In Formulae (1a) and (1b), Q is a phenylene group or a naphthylene group, m is 1 or 2, and each of n is independently 0 or 1).
Public/Granted literature
- US20150337164A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION Public/Granted day:2015-11-26
Information query
IPC分类: