Invention Grant
- Patent Title: Resin-molded component and resin-molding mold
- Patent Title (中): 树脂成型部件和树脂成型模具
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Application No.: US13521711Application Date: 2011-01-12
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Publication No.: US09533439B2Publication Date: 2017-01-03
- Inventor: Kazuyuki Michiyama , Jun Naganuma
- Applicant: Kazuyuki Michiyama , Jun Naganuma
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA, Inc. I.P. Division
- Priority: JP2010-005183 20100113
- International Application: PCT/JP2011/050799 WO 20110112
- International Announcement: WO2011/087140 WO 20110721
- Main IPC: B29C45/00
- IPC: B29C45/00 ; H04N1/00 ; B29L31/00 ; B29C45/37 ; H04N1/10

Abstract:
A resin-molded component includes a thin wall portion, and a rib-like projection configured to protrude from a back surface of the thin wall portion. The rib-like projection includes a plurality of plate-like projections arranged to be spaced from one another. Each of the plurality of plate-like projections is arranged such that an angle formed between a line connecting a point on a longer side of a bottom surface thereof to a gate provided in the thin wall portion and the longer side of the bottom surface thereof is within a range from 10 degrees to 80 degrees.
Public/Granted literature
- US20120295064A1 RESIN-MOLDED COMPONENT AND RESIN-MOLDING MOLD Public/Granted day:2012-11-22
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