Invention Grant
- Patent Title: Method for forming, opening and/or evaluating a connection site
- Patent Title (中): 用于形成，打开和/或评估连接部位的方法
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Application No.: US14309327Application Date: 2014-06-19
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Publication No.: US09533135B2Publication Date: 2017-01-03
- Inventor: Benjamin E. Kusters , Kyungyoon Min
- Applicant: Fenwal, Inc.
- Applicant Address: US IL Lake Zurich
- Assignee: Fenwal, Inc.
- Current Assignee: Fenwal, Inc.
- Current Assignee Address: US IL Lake Zurich
- Agency: Cook Alex Ltd.
- Main IPC: A61M39/10
- IPC: A61M39/10 ; A61M39/14 ; B26F1/26 ; B26F3/00 ; F16L13/00 ; A61M39/08 ; A61M39/18
Abstract:
System, apparatus and method for opening a heat-bonded connection formed between two hollow, flexible thermoplastic conduits. A pressure difference is created between the inside of at least one of the conduits and the ambient atmosphere sufficient to cause expansion of a wall of the tubing conduit in the vicinity of a frangible portion at least partially blocking the connection to disrupt the frangible portion and reduce the blocking.
Public/Granted literature
- US20150367120A1 APPARATUS AND METHOD FOR OPENING AND/OR EVALUATING CONNECTION SITE Public/Granted day:2015-12-24
Information query
IPC分类:
