Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a screen printing machine for applying solder paste to the substrate; a resin dispensing machine arranged downstream of the screen printing machine, for dispensing a thermosetting resin onto at least one reinforcement position on the substrate; a second electronic component placement machine arranged adjacent to and downstream of the resin dispensing machine, for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the resin; a first electronic component placement machine arranged downstream of the second electronic component placement machine, for placing a first electronic component on the substrate; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant.