Invention Grant
- Patent Title: Heat-dissipating EMI/RFI shield
- Patent Title (中): 散热EMI / RFI屏蔽
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Application No.: US14152555Application Date: 2014-01-10
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Publication No.: US09439333B2Publication Date: 2016-09-06
- Inventor: Earl Anthony Daughtry, Jr. , Ronald L. Hodge
- Applicant: Genesis Technology USA, Inc.
- Applicant Address: US GA Lawrenceville
- Assignee: Genesis Technology USA, Inc.
- Current Assignee: Genesis Technology USA, Inc.
- Current Assignee Address: US GA Lawrenceville
- Agency: Lee & Hayes, PLLC
- Agent Charles L. Warner
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K7/20 ; H01L23/552 ; H05K13/04 ; H01L23/40
Abstract:
A heat-dissipating EMI/RFI shield (100) has a shield base (110), a shield cap (130), and a heat sink (150). The shield base has at least one sidewall (112) which defines an open area (113). At least one mounting leg (114) extends from the sidewall and is affixed to a printed circuit board (200). The shield cap has a collar (136) which defines an opening in the shield cap. The shield cap is configured to be mated to the shield base. The heat sink has a boss (156) extending therefrom. The heat sink is configured to be mated to the shield cap. The boss is configured to protrude at least partially into the opening in the shield cap and to make thermal contact with a selected heat generating component (210) on the printed circuit board.
Public/Granted literature
- US20160165764A9 Heat-Dissipating EMI/RFI Shield Public/Granted day:2016-06-09
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