Invention Grant
US09439288B2 Mounting structure of chip component and electronic module using the same
有权
芯片组件的安装结构和使用其的电子模块
- Patent Title: Mounting structure of chip component and electronic module using the same
- Patent Title (中): 芯片组件的安装结构和使用其的电子模块
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Application No.: US14091056Application Date: 2013-11-26
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Publication No.: US09439288B2Publication Date: 2016-09-06
- Inventor: Shuichi Takizawa , Kenichi Kawabata
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2012-263421 20121130
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/18 ; H05K3/28 ; H05K3/34
Abstract:
An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip component 3. The circuit board 2 includes a land 7 and a resist pattern 8A that partially covers the land 7. The chip component 3 has a bottom electrode 6b and a side electrode 6c. The resist pattern 8A has an overlapped portion overlapped with the bottom electrode 6b of the chip component 3 in a planar view. A portion of the mold member 4 is filled at least in a first gap D1 between the resist pattern 8A and the first solder portion 10a.
Public/Granted literature
- US20140153196A1 MOUNTING STRUCTURE OF CHIP COMPONENT AND ELECTRONIC MODULE USING THE SAME Public/Granted day:2014-06-05
Information query
